Your Tasks:

• You will work on complex bonding tasks in the field of microelectronic packaging
• You will develop customer-specific solutions through to process integration
• You will provide technical advice to our demanding customers at home and abroad
• You implement technologies in the production process of the respective customer in cooperation with sales and product management
• You carry out feasibility studies and derive the necessary consequences
• You have knowledge of the current state of the art and continue to expand your technical expertise

Your Skills:

• Degree in engineering in the field of microelectronics, physics, semiconductor technology, electrical engineering, materials science, etc.
• Several years of professional experience in project work and / or project management in the field of semiconductor packaging
• Enthusiasm for the engineering development of process solutions in semiconductor technology
• An analytical and cross-departmental way of thinking, initiative, ability to work in a team and very good organizational skills
• Willingness to travel internationally to visit customers and work with our colleagues abroad
• Very good command of written and spoken English

Your Benefits:

• Job security with a global employer

• Strong team spirit with team events, company outings and Christmas parties

• Plenty of room for growth, working in rapidly growing and innovative markets

• 30 days vacation, flexible hours and working from home options

• Opportunities for development thanks to continuous growth and our DELO Academy

• Voluntary social benefits such as special payments, allowances for travel and dining

• State-of-the-art office and laboratory buildings with a campus atmosphere

• Mental health and fitness programs